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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCZU7EG-3FFVC1156E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 21,403.93 AED | Dhs. 21,403.93 AED |
| 15+ | Dhs. 20,728.02 AED | Dhs. 310,920.30 AED |
| 25+ | Dhs. 20,277.41 AED | Dhs. 506,935.25 AED |
| 50+ | Dhs. 19,150.89 AED | Dhs. 957,544.50 AED |
| 100+ | Dhs. 16,897.85 AED | Dhs. 1,689,785.00 AED |
| N+ | Dhs. 3,379.57 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XCZU7EG-3FFVC1156E
The XCZU7EG-3FFVC1156E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG series, combining advanced processing capabilities with extensive FPGA logic resources. This device integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 graphics processor, delivering exceptional performance for demanding embedded applications.
Key Features & Benefits
- Advanced Processing Architecture: Multi-core ARM processing with 504K+ logic cells for complex design-in requirements
- High-Speed Performance: Operating speeds up to 1.5GHz with 256KB integrated RAM
- Comprehensive Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- Industrial-Grade Reliability: Operating temperature range 0°C to 100°C (TJ), active lifecycle status
- Full Compliance: RoHS/REACH certified with complete traceability documentation
- Flexible Packaging: 1156-FCBGA (35x35mm) for high-density board designs
Target Applications
Ideal for aerospace, automotive, industrial automation, medical equipment, and telecommunications systems requiring long-term availability and high reliability.
Authorized Distributor: All components ship with full manufacturer traceability, original documentation, and compliance certifications. Long lifecycle commitment ensures availability for multi-year design cycles.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 667MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
