XCZU7EV-2FBVB900I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 16,674.69 AED | Dhs. 16,674.69 AED |
| 15+ | Dhs. 16,148.13 AED | Dhs. 242,221.95 AED |
| 25+ | Dhs. 15,797.08 AED | Dhs. 394,927.00 AED |
| 50+ | Dhs. 14,919.46 AED | Dhs. 745,973.00 AED |
| 100+ | Dhs. 13,164.23 AED | Dhs. 1,316,423.00 AED |
| N+ | Dhs. 2,632.85 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EV XCZU7EV-2FBVB900I
The XCZU7EV-2FBVB900I is a high-performance system-on-chip (SoC) combining programmable logic with embedded processing, designed for demanding aerospace, automotive, industrial, and telecommunications applications. This device integrates a Quad ARM® Cortex®-A53 MPCore™ application processor, Dual ARM® Cortex™-R5 real-time processors, and ARM Mali™-400 MP2 graphics processing unit with 504K+ logic cells of FPGA fabric.
Key Features
- Advanced Processing: Quad ARM Cortex-A53 @ 1.3GHz + Dual ARM Cortex-R5 @ 600MHz + Mali-400 MP2 GPU
- High-Density FPGA: 504K+ logic cells for complex programmable logic implementations
- Embedded Memory: 256KB on-chip RAM for efficient data processing
- Rich Connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range: -40°C to +100°C junction temperature for harsh environments
- Compact Package: 900-ball FCBGA (31mm × 31mm) for space-constrained designs
- RoHS Compliant: Meets environmental standards for global deployment
Applications
Ideal for advanced driver assistance systems (ADAS), industrial automation and control, 5G wireless infrastructure, medical imaging equipment, aerospace and defense systems, machine vision, and high-performance embedded computing platforms requiring heterogeneous processing with FPGA acceleration.
Sourcing & Documentation: All units sourced from authorized AMD distributors with full manufacturer documentation and traceability. Long-term availability commitment for lifecycle-critical applications.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EV |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
