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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCZU7EV-L2FBVB900E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 16,674.69 AED | Dhs. 16,674.69 AED |
| 15+ | Dhs. 16,148.13 AED | Dhs. 242,221.95 AED |
| 25+ | Dhs. 15,797.08 AED | Dhs. 394,927.00 AED |
| 50+ | Dhs. 14,919.46 AED | Dhs. 745,973.00 AED |
| 100+ | Dhs. 13,164.23 AED | Dhs. 1,316,423.00 AED |
| N+ | Dhs. 2,632.85 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EV XCZU7EV-L2FBVB900E
The XCZU7EV-L2FBVB900E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EV series, combining advanced FPGA fabric with embedded processing for aerospace, automotive, industrial automation, and telecommunications applications.
Key Features:
- 504K+ Logic Cells – Extensive programmable logic for complex signal processing and custom acceleration
- Quad ARM® Cortex®-A53 MPCore™ – High-performance 64-bit application processors running at 1.3GHz
- Dual ARM® Cortex™-R5 – Real-time processing cores for deterministic control tasks
- ARM Mali™-400 MP2 GPU – Graphics and video processing acceleration
- 256KB RAM – On-chip memory for low-latency operations
- Rich Connectivity – CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range – 0°C to 100°C (TJ) for demanding environments
- 900-FCBGA Package – 31x31mm fine-pitch ball grid array for high-density designs
- RoHS Compliant – Meets environmental and regulatory standards
Applications:
Ideal for advanced driver assistance systems (ADAS), industrial vision systems, 5G wireless infrastructure, aerospace avionics, medical imaging, and high-performance embedded computing requiring both programmable logic and multi-core processing.
Sourcing & Documentation:
Sourced exclusively from authorized AMD distributors with full manufacturer documentation, traceability, and long-term availability support for mission-critical deployments.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EV |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
