XCZU9CG-1FFVB1156I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 14,657.39 AED | Dhs. 14,657.39 AED |
| 15+ | Dhs. 14,194.53 AED | Dhs. 212,917.95 AED |
| 25+ | Dhs. 13,885.96 AED | Dhs. 347,149.00 AED |
| 50+ | Dhs. 13,114.51 AED | Dhs. 655,725.50 AED |
| 100+ | Dhs. 11,571.63 AED | Dhs. 1,157,163.00 AED |
| N+ | Dhs. 2,314.33 AED | Price Inquiry |
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AMD XCZU9CG-1FFVB1156I Zynq UltraScale+ MPSoC FPGA - High-Performance Embedded Processing
The AMD XCZU9CG-1FFVB1156I represents the pinnacle of heterogeneous computing, combining high-performance FPGA fabric with hardened ARM processing subsystems in a single System-on-Chip (SoC). Engineered for mission-critical applications in aerospace, automotive ADAS, industrial automation, medical imaging, 5G infrastructure, and defense systems where real-time processing, programmable logic, and reliability are non-negotiable.
Core Performance Specifications:
- 599,550+ Logic Cells - Massive FPGA resources enabling complex digital signal processing, custom accelerators, and parallel processing architectures
- Dual ARM Cortex-A53 MPCore (1.2GHz) - 64-bit application processing with CoreSight debug and trace for Linux, RTOS, and bare-metal applications
- Dual ARM Cortex-R5 (500MHz) - Deterministic real-time processing with ECC protection for safety-critical control loops and functional safety (ISO 26262, IEC 61508)
- 256KB On-Chip RAM - Low-latency embedded memory for high-speed data buffering and inter-processor communication
- Mali-400 MP2 GPU - Hardware graphics acceleration for HMI and visualization workloads
- Video Codec Unit - H.264/H.265 encode/decode acceleration for video processing pipelines
Comprehensive Connectivity & I/O:
- Gigabit Ethernet - Hardware MAC for industrial networking protocols (EtherCAT, PROFINET, TSN)
- PCIe Gen2 x4 - High-bandwidth host interface for FPGA acceleration cards
- USB 3.0 OTG - Dual-role device/host with PHY
- Dual CAN-FD - Automotive and industrial bus communication
- Quad SPI, Dual QSPI - Boot and configuration flash interfaces
- SD/SDIO 3.0, eMMC 5.1 - Mass storage and removable media support
- 12x UART, 4x I2C, 4x SPI - Extensive peripheral connectivity
- 32x GTH Transceivers (16.3 Gbps) - High-speed serial I/O for 10G Ethernet, Aurora, JESD204B, PCIe
Industrial-Grade Reliability:
- Extended Temperature Range: -40°C to +100°C junction temperature (Industrial I-grade)
- Long Lifecycle Commitment: AMD guarantees extended availability for embedded and aerospace applications
- RoHS & REACH Compliant: Meets global environmental and safety regulations
- Built-In Security: AES-GCM encryption engine, RSA-4096 authentication, secure boot, and anti-tamper features
Target Applications:
Automotive: Advanced Driver Assistance Systems (ADAS), sensor fusion (LiDAR, radar, camera), autonomous driving compute platforms, in-vehicle infotainment (IVI)
Industrial: Machine vision inspection, robotics motion control, programmable logic controllers (PLC), industrial IoT gateways, predictive maintenance
Medical: Ultrasound beamforming, CT/MRI image reconstruction, surgical robotics, patient monitoring systems
Aerospace & Defense: Software-defined radio (SDR), radar signal processing, avionics, secure communications, electronic warfare
Communications: 5G small cell baseband, massive MIMO, network function virtualization (NFV), edge computing
Why Choose Zynq UltraScale+ Architecture?
The heterogeneous architecture enables optimal hardware/software partitioning: offload compute-intensive tasks (FFT, matrix operations, encryption) to FPGA fabric while running control software and OS on ARM cores. This delivers 10-100x performance-per-watt advantage over CPU-only solutions. The tightly-coupled architecture with cache-coherent interconnect (CCI-400) ensures low-latency data sharing between processing subsystems.
Development Ecosystem: Supported by AMD Vivado Design Suite, Vitis Unified Software Platform, PetaLinux, and extensive IP library including DSP, video, and connectivity cores.
Package & Thermal:
1156-FCBGA (35mm x 35mm) - Flip-chip ball grid array with excellent thermal dissipation characteristics. Compatible with standard PCB manufacturing processes. Thermal solution design guides available.
Authorized Distribution & Support:
Genuine AMD Components - Factory-sealed packaging with full supply chain traceability and manufacturer warranty. Our technical team provides pre-sales design consultation, reference designs, and post-sales engineering support.
In Stock & Ready to Ship - Available for immediate delivery with flexible logistics options. Volume pricing available for production quantities. Contact our sales team for custom quotations, lead times, and technical documentation (datasheets, application notes, reference manuals).
Quality Assurance: 100% authentic components sourced directly from AMD authorized channels. Certificate of Conformance (CoC) and test reports available upon request.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
