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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCZU9CG-1FFVC900I
Regular price
Dhs. 12,973.16
Regular price
Dhs. 13,655.96
Sale price
Dhs. 12,973.16
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 12,973.16 AED | Dhs. 12,973.16 AED |
| 15+ | Dhs. 12,563.48 AED | Dhs. 188,452.20 AED |
| 25+ | Dhs. 12,290.36 AED | Dhs. 307,259.00 AED |
| 50+ | Dhs. 11,607.57 AED | Dhs. 580,378.50 AED |
| 100+ | Dhs. 10,241.97 AED | Dhs. 1,024,197.00 AED |
| N+ | Dhs. 2,048.39 AED | Price Inquiry |
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Recycling Electronic Components
AMD XCZU9CG-1FFVC900I Zynq UltraScale+ MPSoC CG FPGA
The AMD XCZU9CG-1FFVC900I is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) combining FPGA fabric with embedded processing for demanding aerospace, automotive, industrial automation, and telecommunications applications.
Key Features
- 599K+ Logic Cells - Extensive programmable logic resources for complex designs
- Dual ARM Cortex-A53 MPCore (1.2GHz) - High-performance 64-bit application processing with CoreSight debug
- Dual ARM Cortex-R5 (500MHz) - Real-time processing for deterministic control with CoreSight debug
- 256KB On-Chip RAM - Fast embedded memory for critical data
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (junction temperature)
- Rich Connectivity - CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO interfaces
- 900-FCBGA Package - 31mm x 31mm fine-pitch ball grid array for high I/O density
- RoHS Compliant - Meets environmental standards for global markets
Applications
Ideal for advanced embedded systems requiring heterogeneous processing, hardware acceleration, and real-time control including aerospace avionics, automotive ADAS, industrial robotics, 5G wireless infrastructure, medical imaging, and defense systems.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
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