AMD XCZU9CG-2FFVB1156I

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Regular price Dhs. 18,765.11
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AMD Zynq® UltraScale+™ MPSoC CG - High-Performance FPGA with Embedded Processing

The XCZU9CG-2FFVB1156I combines programmable logic with dual ARM® Cortex®-A53 and Cortex®-R5 processors, delivering exceptional performance for demanding industrial, automotive, aerospace, and communications applications. With 599K+ logic cells and comprehensive connectivity options, this device enables complex system integration on a single chip.

Key Features

  • Dual-core ARM Cortex-A53 MPCore (1.3GHz) for application processing
  • Dual-core ARM Cortex-R5 (533MHz) for real-time control
  • 599K+ logic cells for extensive FPGA fabric
  • 256KB on-chip RAM for fast data access
  • Industrial temperature range: -40°C to 100°C (TJ)
  • Rich connectivity: Ethernet, USB OTG, CANbus, PCIe, I2C, SPI, UART, MMC/SD/SDIO
  • 1156-FCBGA package (35x35mm) for space-efficient designs

Applications

Ideal for advanced embedded vision, industrial automation, motor control, software-defined radio, 5G wireless infrastructure, ADAS (Advanced Driver Assistance Systems), and aerospace/defense systems requiring high reliability and long-term availability.

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Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)

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