AMD XCZU9CG-L1FFVB1156I

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Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Bulk |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

AMD XCZU9CG-L1FFVB1156I - Zynq® UltraScale+™ MPSoC FPGA

The AMD XCZU9CG-L1FFVB1156I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5 processors, integrated with a powerful Zynq® UltraScale+™ FPGA featuring 599K+ logic cells. This industrial-grade device delivers exceptional processing power and programmable logic flexibility for demanding aerospace, automotive, industrial, medical, and telecommunications applications.

Key Features & Benefits

  • Dual-Core Processing: ARM Cortex-A53 MPCore at 1.2GHz + ARM Cortex-R5 with CoreSight for real-time control
  • Massive Logic Capacity: 599K+ logic cells for complex FPGA implementations
  • 256KB On-Chip RAM: High-speed embedded memory for data-intensive operations
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range: -40°C to +100°C (TJ) for harsh environments
  • Compact 1156-FCBGA Package: 35x35mm footprint for space-constrained designs
  • RoHS Compliant: Meets environmental and regulatory standards

Ideal Applications

Perfect for advanced embedded systems requiring high-performance processing, programmable logic, and extensive I/O connectivity including industrial automation, medical imaging, aerospace avionics, automotive ADAS, 5G wireless infrastructure, and video processing systems.