AMD XCZU9CG-L1FFVB1156I
Regular price
Dhs. 16,416.14
Regular price
Dhs. 17,280.12
Sale price
Dhs. 16,416.14
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 16,416.14 | Dhs. 16,416.14 |
| 15+ | Dhs. 15,897.71 | Dhs. 238,465.65 |
| 25+ | Dhs. 15,552.11 | Dhs. 388,802.75 |
| 50+ | Dhs. 14,688.10 | Dhs. 734,405.00 |
| 100+ | Dhs. 12,960.09 | Dhs. 1,296,009.00 |
| N+ | Dhs. 2,592.02 | Price Inquiry |
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AMD XCZU9CG-L1FFVB1156I - Zynq® UltraScale+™ MPSoC FPGA
The AMD XCZU9CG-L1FFVB1156I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5 processors, integrated with a powerful Zynq® UltraScale+™ FPGA featuring 599K+ logic cells. This industrial-grade device delivers exceptional processing power and programmable logic flexibility for demanding aerospace, automotive, industrial, medical, and telecommunications applications.
Key Features & Benefits
- Dual-Core Processing: ARM Cortex-A53 MPCore at 1.2GHz + ARM Cortex-R5 with CoreSight for real-time control
- Massive Logic Capacity: 599K+ logic cells for complex FPGA implementations
- 256KB On-Chip RAM: High-speed embedded memory for data-intensive operations
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- Industrial Temperature Range: -40°C to +100°C (TJ) for harsh environments
- Compact 1156-FCBGA Package: 35x35mm footprint for space-constrained designs
- RoHS Compliant: Meets environmental and regulatory standards
Ideal Applications
Perfect for advanced embedded systems requiring high-performance processing, programmable logic, and extensive I/O connectivity including industrial automation, medical imaging, aerospace avionics, automotive ADAS, 5G wireless infrastructure, and video processing systems.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Bulk | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |  |
XCZU9CG-L1FFVB1156I.pdf
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