AMD XCZU9EG-1FFVC900E

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AMD XCZU9EG-1FFVC900E Zynq UltraScale+ MPSoC EG

The XCZU9EG-1FFVC900E is a high-performance system-on-chip (SoC) combining programmable logic with processing power. This industrial-grade device features a Quad ARM Cortex-A53 MPCore processor with CoreSight, Dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2 graphics, delivering exceptional computational capabilities for demanding embedded applications.

Key Features:

  • 599K+ logic cells for complex FPGA designs
  • Multi-core ARM processing: Quad Cortex-A53 (1.2GHz) + Dual Cortex-R5 (600MHz)
  • 256KB on-chip RAM with extensive connectivity options
  • Industrial temperature range: 0°C to 100°C (TJ)
  • Comprehensive I/O: Ethernet, USB OTG, CANbus, PCIe, and more
  • 900-FCBGA (31x31mm) package for high-density designs

Applications: Ideal for automotive ADAS systems, industrial automation, aerospace/defense, 5G wireless infrastructure, medical imaging, and high-performance embedded computing platforms requiring both FPGA flexibility and ARM processing power.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.