Texas Instruments XOMAPL137AZKB3

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Texas Instruments XOMAPL137AZKB3 - High-Performance ARM + DSP Microprocessor

The XOMAPL137AZKB3 from Texas Instruments represents a powerful dual-core solution combining an ARM926EJ-S processor with a C674x DSP core, delivering exceptional performance for embedded industrial applications requiring both control and signal processing capabilities.

Key Features & Benefits

  • Dual-Core Architecture: ARM926EJ-S (300MHz) for system control + C674x DSP for real-time signal processing
  • Rich Connectivity: 10/100Mbps Ethernet, dual USB (1.1 + 2.0 with PHY), MMC/SD, SPI, UART, I2C, McASP
  • Display Support: Integrated LCD controller for HMI and visualization applications
  • Industrial-Grade Reliability: 0°C to 90°C operating range, surface mount 256-BGA package
  • Flexible Memory Interface: SDRAM controller with HPI for external processor communication
  • Low Power Design: 1.8V/3.3V I/O voltage for energy-efficient operation

Ideal Applications

Perfect for industrial automation, medical devices, motor control, audio processing, portable instrumentation, and embedded systems requiring both control and DSP functionality in a single chip.

Why Choose HQICKEY?

We provide 100% authentic Texas Instruments components with long lifecycle availability, dedicated technical support, and reliable global fulfillment for production-scale requirements. Every component is quality-controlled and backed by our authenticity guarantee.


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Product attributes Property Value
Manufacturer Texas Instruments
Product Series OMAP-L1x
Packaging Tube |
Core Processor ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 300MHz
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
RAM Controllers SDRAM
Graphics Acceleration No
Display & Interface Controllers LCD
Ethernet 10/100Mbps (1)
SATA -
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 3.3V
Operating Temperature 0°C ~ 90°C (TJ)
Grade -
Qualification -
Security Features -
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-BGA
Additional Interfaces HPI, I2C, McASP, MMC/SD, SPI, UART
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