Altera 5ASXBB5D4F40C5N

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Product attributes Property Value
Manufacturer Altera
Product Series Arria V SX
Packaging | Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 64KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes FPGA - 462K Logic Elements
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FBGA, FC (40x40)

Altera Arria V SX SoC FPGA - 5ASXBB5D4F40C5N

The Altera Arria V SX 5ASXBB5D4F40C5N is a high-performance System-on-Chip (SoC) FPGA combining 462K logic elements with a powerful dual ARM® Cortex®-A9 MPCore™ processor running at 800MHz. This advanced device delivers exceptional processing power and flexibility for demanding industrial, automotive, aerospace, communications, and edge computing applications.

Key Features

  • Dual ARM Cortex-A9 MPCore with CoreSight: 800MHz processing power for complex embedded applications
  • 462K Logic Elements: Extensive FPGA fabric for custom hardware acceleration and parallel processing
  • 64KB RAM: Integrated memory for efficient data handling
  • Rich Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces
  • Advanced Peripherals: DMA, POR, WDT for robust system design
  • Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation in harsh environments
  • Compact 1517-FBGA Package: 40x40mm footprint for space-constrained designs

Applications

This SoC FPGA is engineered for high-performance applications requiring both programmable logic and embedded processing, including industrial automation, automotive ADAS systems, aerospace avionics, 5G/communications infrastructure, medical imaging, and edge AI/ML acceleration.

Why Choose Altera Arria V SX?

The Arria V SX family offers the optimal balance of performance, power efficiency, and cost-effectiveness for mid-range FPGA applications. With integrated ARM processing and extensive I/O capabilities, this device enables system consolidation, reduces board complexity, and accelerates time-to-market for next-generation embedded systems.