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Altera
5ASXFB5G4F35C4N
5ASXFB5G4F35C4N
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,946.61 AED | Dhs. 355,946.61 AED |
| 15+ | Dhs. 344,706.19 AED | Dhs. 5,170,592.85 AED |
| 25+ | Dhs. 337,212.58 AED | Dhs. 8,430,314.50 AED |
| 50+ | Dhs. 318,478.54 AED | Dhs. 15,923,927.00 AED |
| 100+ | Dhs. 281,010.48 AED | Dhs. 28,101,048.00 AED |
| N+ | Dhs. 56,202.10 AED | Price Inquiry |
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Altera Arria V SX FPGA System-on-Chip (SoC)
The 5ASXFB5G4F35C4N is a high-performance FPGA System-on-Chip from Altera's Arria V SX family, combining powerful dual ARM® Cortex®-A9 MPCore™ processors with extensive FPGA fabric for demanding industrial, automotive, aerospace, and communications applications.
Key Features
- 462K Logic Elements - Extensive FPGA fabric for complex digital logic implementation
- Dual ARM Cortex-A9 MPCore with CoreSight - High-performance 925MHz processing cores
- 64KB Integrated RAM - On-chip memory for fast data access
- Rich Connectivity - EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Industrial Temperature Range - Operates reliably from 0°C to 85°C (TJ)
- Advanced Peripherals - DMA, Power-On Reset (POR), Watchdog Timer (WDT)
Applications
Ideal for high-performance embedded systems requiring both programmable logic and processor capabilities, including industrial automation, automotive ADAS, aerospace avionics, telecommunications infrastructure, and edge computing platforms.
Technical Specifications
| Product attributes | Property Value |
| Manufacturer | Altera |
| Product Series | Arria V SX |
| Packaging | | Tray |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 64KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 925MHz |
| Primary Attributes | FPGA - 462K Logic Elements |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA, FC (35x35) |
Package Information
Supplied in 1152-pin Fine-Pitch Ball Grid Array (FBGA) with flip-chip technology, 35mm × 35mm footprint. Ships in protective tray packaging to ensure device integrity during transport and storage.
Quality & Reliability
Manufactured by Altera (now Intel PSG) to stringent quality standards, this device is suitable for mission-critical applications requiring long-term availability and proven reliability in harsh operating environments.
Datasheets:
5ASXFB5G4F35C4N.pdf
